MEHSA 4 (Maximum Efficiency Heat Sink Application)
4 (Maximum Efficiency Heat Sink Application - gen. 4) is a proprietary process that yields a better heat transfer than traditional FET mounting techniques, using the exact same components. An insulated metal substrate operating with minimal thermal resistance spreads heat both downward & outward to quickly dissipate heat from each device across the heatsink. This process combined with our optimized heatsink designs, DSM (Discrete Surface Mount) technology and MOSFET devices, allows Rockford Fosgate to squeeze more watts per cubic inch from every output device as well as provide consistent thermal stability. The 4th generation is a ceramic isolator and provides improved EMI and advanced thermal coupling. The higher power handling results in a high reduction in thermal impedance.">MEHSA 4 reduces MOSFET temperatures, lowers distortion, increases durability and prolongs the output device life span.